Chinese manufacturer Xiaomi has released a new foldable smartphone, the 18 Fold, featuring its own system-on-chip and memory components. This launch occurs during a busy period for foldable phones, with Huawei also introducing a new model and Apple expected to unveil its first foldable device later this week. The activity reflects an industry focus on this growing market segment.

According to the South China Morning Post, Huawei Technologies recently introduced its initial smartphone, powered by a next generation mobile processor based on the company's proprietary Tau Scaling Law. This aims to improve chip performance and reduce reliance on advanced foreign semiconductor equipment. The device's unveiling precedes models from Apple and Xiaomi.

Hangzhou-based artificial intelligence organisation DeepSeek is preparing a significant deployment of Huawei Ascend 950DT accelerators. The plan involves installing at least 160,000 of Huawei's next generation of chips at a new data centre in Inner Mongolia. This facility is being constructed on a gigawatt scale site, with chip and memory supply dictating delivery pace for this extensive model inference cluster.