Intel Taps TSMC for 2nm Chip Production Ahead of 2026 Launch
Intel has reportedly placed orders with Taiwan Semiconductor Manufacturing Co. for its advanced 2-nanometre process, marking a significant step in its next-generation processor development.
The move follows similar orders from AMD and signals Intel’s continued reliance on TSMC for cutting-edge semiconductor manufacturing.
Intel previously outsourced compute tiles for two processors to TSMC, which became part of the Intel Core Ultra 200V laptop series (Lunar Lake) and the Core Ultra 200S desktop series (Arrow Lake). These were Intel’s first AI PC processors.
The compute tiles for those processors were manufactured using TSMC’s N3B process, while GPU tiles used N5P and SoC/I/O tiles used N6.
The new collaboration is reportedly focused on a 2nm product, widely speculated to be the compute tile for Intel’s upcoming Nova Lake PC processors.
These processors are expected to launch in 2026.
Intel has placed orders with TSMC for its 2nm process
The collaboration may support Intel’s Nova Lake processors
Intel previously used TSMC’s N3B, N5P, and N6 processes for AI PC chips
Source: TECHNODE
