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CES 2022: Intel Brings H-Series to Amp Up Evo Line and Ultra-Thins

Updated: Jan 5, 2022

While Intel’s big Alder Lake line-up reveal is noteworthy, even more impressive is seeing Team Blue introduce its high-performance H-series for the versatile Intel Evo mobile processer family. This is part of the Intel Evo 3rd Edition launch roadmap that was revealed at Intel’s Consumer Electronics Show 2022 (CES 2022) pre-briefing.

Intel dropped its updated Intel Evo Badge late last year. Credit: Intel

Intel Evo, best known for its decent-to-great performance for mobile and battery longevity, is now looking to combine these popular offerings with the top-end performance of the H-series. This higher power-draw pairing – at 35W to 45W TDP – will also come with Intel Arc Discrete Graphics and Deep Link technologies.

In short, it will be what creators and power users have asked of Intel for years – high-spec performance in a superbly slim chassis.

Other upgrades to expect are the inclusion of Intel Wi-Fi 6E and two different digital suites – Intel Connectivity Performance and Virtual Sensing Technology.

This move is part of Intel’s ongoing vision to deliver purposeful computing experiences that unlock the user’s potential and enable each person to focus, create and communicate. In fact, it encompasses what Intel wants as it aims to do more than just develop a powerful System-on-Chip platform that packs in the latest innovations.

Credit: Intel

As is, Intel is now exploring various concepts with its close partners to produce over 100 ultra-thin and super-versatile laptops and convertible computers.

This isn’t a new strategy for Intel as it had delved deep into this with Ultrabooks, its first-gen “Intel Devil Canyon” Next Unit of Computing concept and the subsequent “Intel Skull Canyon”, “Intel Hades Canyon” and “Intel Ghost Canyon” entries that came after; the Intel Whisky Lake powered dual-screen “Intel Twin Rivers” that takes inspiration from the Lenovo YOGA Book series; and the hyped-up “Intel Honeycomb Glacier” companion dual-screen system that made its only appearance at COMPUTEX TAIPEI 2019.

Beyond bringing the H-series to its ultra-thin range, Intel announced its new arrangement with computer accessory players to ensure they can help expand the user experience. This collaboration will see Intel extend its Intel Engineered For Program and co-engineering capabilities to all its accessory partners.

As a cap-off to the pre-briefing, Santa Clara also confirmed it is working with various Intel Evo platform manufacturers to develop and roll-out even more foldable form factors for laptops in 2022. Interestingly, this will include large display format systems.

Credit: Intel

Additional details – like launch timeframe, real-world testing and recommended retail pricing – will be available in the coming weeks.

For the latest announcements from Las Vegas, head on over to the CES 2022 special coverage page.

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