Apple Secures First Batch of TSMC's 2nm Chips for iPhone 17 Series

Apple secures first batch of TSMC's 2nm chips for iPhone 17 series. TSMC's 2nm process technology expected to offer a 10-15% performance boost over 3nm. Power consumption set to be reduced by up to 30%.

Credit: TechNode/Coco Gao

According to Taiwanese media outlet Commercial Times, the trial production of these chips is expected to commence this week. The installation of equipment for the 2nm process chips took place in TSMC's new Hsinchu Baoshan fab during the second quarter of this year. These highly anticipated chips are set to feature in the iPhone 17 series, which is slated for release in 2025.

Industry sources suggest that TSMC's 2nm process technology could offer a significant performance boost of 10-15% compared to the current 3nm chips. Moreover, it is expected to reduce power consumption by up to 30%. This advancement in chip technology is a testament to Apple's commitment to delivering cutting-edge performance and energy efficiency in its devices.

In addition to the 2nm chips, Apple is also planning to adopt a new packaging technology called SoIC (System on Integrated Chips) for its M5 chip in 2025. This innovative packaging technique involves stacking multiple chips with different functions to create a compact three-dimensional structure. By integrating various components into a single package, Apple aims to enhance the overall performance and efficiency of its devices.

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• Apple secures first batch of TSMC's 2nm chips for iPhone 17 series

• TSMC's 2nm process technology expected to offer a 10-15% performance boost over 3nm

• Power consumption set to be reduced by up to 30%

Source: TECHNODE